Our Decapsulation processes use the latest techniques to decapsulate all types of plastic encapsulated parts in order to expose the die in today's integrated circuits (IC). This procedure is done so that analysis testing and probing can be carried out the IC after the decapsulation. Decapsulation exposes the integrated circuit for ussually for the purpose of direct probe connection to the silicon die. Various techniques have been developed to achieve this, suitable methods are selected to be compatible with the particular packaging configuration in order to minimize complications from introduction of foreign matter or damage to the silicon device. Some…

A prerequisite for the use of SIMIS, is that the SIM card must be functional. A physically damaged, broken or dirty SIM may not function correctly, resulting in the recovery of corrupted data, or no data at all. In the forensic data recovery environment, SIM's will be presented in a variety of different conditions, ranging from good, but lightly soiled, through blood soaked to physically broken. Lightly soiled and blood soaked SIM's may be cleaned using appropriate methods, ensuring that the SIM is not further damaged taking care to preserve surface printing where possible. However, physically damaged or broken SIM's…