Compact Bench-top Plasma Etch System

A robust bench top machine that is perfect for small-scale plasma treatment 
This unit can use up to two gases simultaneously for plasma cleaning and surface modification (etching). The system has been used for training purposes, resulting in very low volume use and is in near new condition. 

The system has been used to demonstrate plasma etching for the clean up for delicate / damaged BGA devices. Etching SIM card modules to expose bond wires, cleaning of acid salts from devices that have been exposed to acid etching and other surface cleaning applications.

This is a two gas system. Gases may be used simultaniously or separately. The Plasma recipie maybe created and pre stored or the system maybe used manually with timers to allow un attended operation.

The system has been used with the active gases Oxygen and Tetrafluoromethane as these gave the best results in the applications for which the machine was used. Other gases can be used if desired.

The system is capable of implementing a Nitrogen Purge after the Plasma cycle is complete. The Nitrogen Purge is an optional retrofit.  Nitrogen Purge is not currently fitted. All parts are with the system including new Nitrogen Regulator.

BOC pressure regulators for all three gasses are supplied witht he system as is the required Vaccum pump anmd connections, along with waste pipe for exhaust gassses.

The system is available with all parts ready for use, except gas and Cylinders that will need to be purchased or hired. Currently we rent from BOC.